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Xiaomi launches three in-house chips at once: 3nm XRING O3, O100 AI accelerator and D100 driving chip

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TrendForce
XRING O3
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The O3 is in mass production and debuts in the Xiaomi 18 Fold and Pad 9 Pro Max in September. It is reportedly the first phone chip to support LPDDR6, using memory from CXMT; the D100 is expected for commercial use in 2027.

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